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  • LPC1313FHN33/01,51
Microcontroller Series LPC13xx
Core Processor ARM® Cortex®-M3
Core Size 32-Bit Single-Core
Speed 72 MHz
Connectivity I²C, Microwire, SPI, SSI, UART/USART
Peripherals Brown-out Detect/Reset, POR, WDT
Number of I/O 28
Program Memory Size 32KB (32K x 8)
Program Memory Type FLASH
RAM Size 8K x 8
Supply Voltage 2 ~ 3.6 V
Data Converters A/D 8x10b
Oscillator Type Internal
Technical Documents
Link to Manufacturer's page


LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller

Product Change Notifications

PCN 202011011I  Issued: 2020-12-15  Effective: 2020-12-16  NXP Will Add a Sealed Date to the Product Label

Package / Case
Mounting Surface mount
Package Type/Name 32-VQFN Exposed Pad
Package Version SOT865-3
Dimensions 7 * 7 * 0.85 mm
Termination Count 32
Drawings, CAD-Models

Package Drawing

Material Plastic
Single Unit Weight (Net) 0.134 g
Operating Temperature -40°C ~ 85°C (TA)
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Peak Package Body Temperature (PPT) (°C)

Lead Soldering - 240 °C

Lead Free Soldering - 260 °C

Primary Packing Tape / Reel
Primary Packing Weight 1450 g
Primary Packing Dimensions 340 * 340 * 47 mm
Primary Packing QTY 4000
Environmental & Export
RoHS Status +
ECCN 3A991A2
HTS Code 8542319000
Country Of Origin (COO) Taiwan

Please verify the characteristics of the product in manufacturer's datasheet in the "Technical Documents" section or on the manufacturer's website.


  • грн.146.640

  • Ex Tax: грн.122.200