| Microcontrollers | |
| Microcontroller Series | LPC13xx |
| Core Processor | ARM® Cortex®-M3 |
| Core Size | 32-Bit Single-Core |
| Speed | 72 MHz |
| Connectivity | I²C, Microwire, SPI, SSI, UART/USART |
| Peripherals | Brown-out Detect/Reset, POR, WDT |
| Number of I/O | 28 |
| Program Memory Size | 32KB (32K x 8) |
| Program Memory Type | FLASH |
| EEPROM Size | - |
| RAM Size | 8K x 8 |
| Supply Voltage | 2 ~ 3.6 V |
| Data Converters | A/D 8x10b |
| Oscillator Type | Internal |
| Technical Documents | |
| Link to Manufacturer's page | |
| Datasheets | |
| Product Change Notifications | PCN 202011011I Issued: 2020-12-15 Effective: 2020-12-16 NXP Will Add a Sealed Date to the Product Label |
| Package / Case | |
| Mounting | Surface mount |
| Package Type/Name | 32-VQFN Exposed Pad |
| Package Version | SOT865-3 |
| Dimensions | 7 * 7 * 0.85 mm |
| Termination Count | 32 |
| Drawings, CAD-Models | |
| Material | Plastic |
| Single Unit Weight (Net) | 0.134 g |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Peak Package Body Temperature (PPT) (°C) | Lead Soldering - 240 °C Lead Free Soldering - 260 °C |
| Packing | |
| Primary Packing | Tray in Carton |
| Primary Packing Weight | 584 g |
| Primary Packing Dimensions | 352 * 182 * 35 mm (carton) |
| Primary Packing QTY | 260 |
| Environmental & Export | |
| RoHS Status | + |
| ECCN | 3A991A2 |
| HTS Code | 8542319000 |
| Country Of Origin (COO) | Taiwan |
| Date Code | 2152 (Week 52 of Year 2021) |
Please verify the characteristics of the product in manufacturer's datasheet in the "Technical Documents" section or on the manufacturer's website.
LPC1313FHN33,551
- Brand: NXP Semiconductors
- Product Code: LPC1313FHN33,551
- Availability: 780
-
грн.133.320
- Ex Tax: грн.111.100
This product has a minimum quantity of 260
This product is sold in quantity multiple to 260