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  • LPC1313FHN33,551
Microcontroller Series LPC13xx
Core Processor ARM® Cortex®-M3
Core Size 32-Bit Single-Core
Speed 72 MHz
Connectivity I²C, Microwire, SPI, SSI, UART/USART
Peripherals Brown-out Detect/Reset, POR, WDT
Number of I/O 28
Program Memory Size 32KB (32K x 8)
Program Memory Type FLASH
RAM Size 8K x 8
Supply Voltage 2 ~ 3.6 V
Data Converters A/D 8x10b
Oscillator Type Internal
Technical Documents
Link to Manufacturer's page


LPC1311/13/42/43 32-bit ARM Cortex-M3 microcontroller

Product Change Notifications

PCN 202011011I  Issued: 2020-12-15  Effective: 2020-12-16  NXP Will Add a Sealed Date to the Product Label

Package / Case
Mounting Surface mount
Package Type/Name 32-VQFN Exposed Pad
Package Version SOT865-3
Dimensions 7 * 7 * 0.85 mm
Termination Count 32
Drawings, CAD-Models

Package Drawing

Material Plastic
Single Unit Weight (Net) 0.134 g
Operating Temperature -40°C ~ 85°C (TA)
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Peak Package Body Temperature (PPT) (°C)

Lead Soldering - 240 °C

Lead Free Soldering - 260 °C

Primary Packing Tray in Carton
Primary Packing Weight 584 g
Primary Packing Dimensions 352 * 182 * 35 mm (carton)
Primary Packing QTY 260
Environmental & Export
RoHS Status +
ECCN 3A991A2
HTS Code 8542319000
Country Of Origin (COO) Taiwan
Date Code 2152 (Week 52 of Year 2021)

Please verify the characteristics of the product in manufacturer's datasheet in the "Technical Documents" section or on the manufacturer's website.


  • грн.133.320

  • Ex Tax: грн.111.100

This product has a minimum quantity of 260
This product is sold in quantity multiple to 260